Package for Light Emitting Device and Method for Packaging the Same

ABSTRACT

There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increased.

TECHNICAL FIELD

The present invention relates to a light emitting device package and apackaging method, and more particularly, to a light emitting devicepackage and a packaging method in which at least one high-power lightemitting device is packaged and mounted to allow a high luminance,facilitate a heat sink, and improve a freedom degree of a circuitdesign.

BACKGROUND ART

Generally, a light emitting diode is a typical light emitting device.The light emitting diode refers to a light emitting device for emittingexcess energy as light when electrons and holes are recombined. Thelight emitting diode is being widely used in various fields such as anumeral/character displaying element, a signal light, a light source fora photo coupler and a display device.

Further, the following four conditions should be satisfied tomanufacture the light emitting device in good quality. A first conditionis a good luminance, a second condition is a long lifetime, a thirdcondition is a thermal stability, and a fourth condition is a lowvoltage operation.

Among them, the luminance has a close relation to a consumption power. Avariety of methods are being developed to currently increase theluminance of the light emitting diode.

Meanwhile, according to the trend of miniaturization and slimness of aninformation communication apparatus, a variety of parts of the apparatussuch as a resistor, a condenser and a noise filter are being moreminiaturized. Together with this, many attempts are being made todirectly mount the light emitting device with a volume reduced, on thecircuit board in a package format.

A related-art light emitting device package is

In a structure of the related-art light emitting device package, anelectrode lead frame is disposed at a body of the light emitting devicepackage to apply a power source to a light emitting device from anexternal Printed Circuit Board (PCB).

A mold lens is attached to an upper portion of the package body toimprove a luminous efficiency of an emission light of the light emittingdevice. Additionally, an assembly having the mounted light emittingdevice is engaged with a lower portion of the package body as below.First, a reflection cup having a high rate of light reflection isengaged to an upper portion of a conductor, and the light emittingdevice is mounted on a sub mount, which is formed of silicon, by a flipchip bonding or a wire bonding. After that, the sub mount is etched toprovide a reflection groove part, and a reflection layer is formed onthe reflection groove part. After that, the light emitting device ismounted.

However, the related-art package has a disadvantage in that a pluralityof light emitting devices cannot be placed in a single package and amanufacture process is complex.

Another related-art light emitting device package is described.

A circuit board having the light emitting device package and aconductive wire is placed at an internal and lower side of a frame. Thelight emitting device package is panel-shaped. Additionally, anepoxy-molding layer is provided within the frame to disperse a light ofthe light emitting device package, and a diffusion plate is adhered toan upper portion of the frame. At this time, the diffusion plate and thelight emitting device should be spaced apart from each other to increasea luminance. As such, the diffusion plate and the light emitting devicepackage should be spaced apart and maintained at five or moremillimeter. Therefore, the related-art light emitting device package hasa drawback in that it is difficult to achieve lightweight, slimness andsimplification of a panel.

The above-described related-art light emitting device package has adrawback in that in case where a magnitude of current is increased toobtain a high-power light, a high heat is generated due to a badperformance of a heat sink. Additionally, in case where the lightemitting device package has the high heat as it is without dissipation,a resistance is much increased to reduce an luminous efficiency.Specifically, the related-art light emitting device package has adisadvantage in that since the conductor, the reflection cup, thepackage body and the like are separated from one another, the generatedheat of the light emitting device is not easily transmitted to theexterior due to the existence of many thermal resistors.

Further, the related-art light emitting device package has adisadvantage in that since only one light emitting device is installedwithin the package body, three light emitting device packages should beoperated as a set to embody a high-power white light. In this case,there is a disadvantage in that a control circuit is complex and avolume is increased.

Furthermore, since a total board area is increased in a single producttype of a multi-combined light emitting device package to connect anelectrode with the exterior, an assembly process is increased in cost.

DISCLOSURE Technical Problem

Accordingly, the present invention is directed to a light emittingdevice package and a packaging method that substantially obviate one ormore of the problems due to limitations and disadvantages of the relatedart.

An object of the present invention is to provide a light emitting devicepackage in which a plurality of light emitting devices are directlymounted on a metal board to increase an effect of heat sink, therebyreducing a heat-dependent electro-optic phenomenon of a light emittingdevice, and in which its structure is suitable to arrange a plurality oflight emitting devices on a Printed Circuit Board (PCB) with a spacelimited.

Another object of the present invention is to provide a light emittingdevice package in which its structure is simplified to allow each of itsstructural elements to be collectively placed on a metal board, therebyimproving an optical function.

A further object of the present invention is to provide a light emittingdevice package in which even in case where a plurality of the lightemitting device packages are effectively arranged and againparallel-constructed to be used as a light source and employed in aliquid crystal display device by using a RGB COB (Chip On Board), aneffect of heat sink and an easiness of process are improved.

Technical Solution

To achieve these and other advantages and in accordance with the purposeof the present invention, as embodied and broadly described, there isprovided a light emitting device package including: a circuit board; atleast one barrier part provided to have a predetermined thickness abovethe circuit board; at least one light emitting device chip seated at thebarrier part, and having a power source applied from the circuit board;a molding part filling an internal space between the barrier parts in astate where the light emitting device chip is housed in the internalspace; and a lens unit having at least one lens provided at an upperside of the molding part.

In another aspect of the present invention, there is provided a lightemitting device package including: a light emitting device modulehaving: a light emitting device chip comprised of at least one lightemitting device, a first barrier for housing the light emitting devicechip, and a molding part provided in an internal space between the firstbarriers; a circuit board having: an electric circuit layer having acircuit electrically connecting with the light emitting device module,an insulating layer provided at a lower surface of the electric circuitlayer, and a metal PCB (Metal Core Print Circuit Board) base fordissipating a heat, which is generated from the light emitting device,to the exterior; and a lens unit provided at an upper side of the lightemitting device module.

In a further another aspect of the present invention, there is provideda light emitting device package including: a plurality of light emittingdevices; a metal circuit board for seating the light emitting devicethereat to input and output a power source to and from the lightemitting devices; at least one barrier placed outside of the lightemitting device and above the metal circuit board; and a lens unitdisposed at an upper side of the barrier, for irradiating an emissionlight of the light emitting device to the exterior.

In a still another aspect of the present invention, there is provided amethod of manufacturing a light emitting device package, the methodincluding the steps of: mounting a plurality of light emitting devicesabove a metal circuit board; providing a barrier above the circuitboard; performing a molding process in an internal space between thebarriers in which the light emitting device is mounted; and attaching alens at an upper side of the barrier after the molding process isperformed.

Advantageous Effects

The present invention has an advantage in that the plurality of lightemitting devices can be mounted in a package format to maximize aluminance and provide an excellent heat sink, and the plurality of lightemitting devices are single-packaged and mounted in the package formatto simplify a manufacture process.

Further, the present invention has an effect in that the package isreduced in size and thickness and applied to a liquid crystal displaydevice being in a trend of miniaturization to contribute to a slimnessof the liquid crystal display device.

DESCRIPTION OF DRAWINGS

FIG. 1 is a sectional view illustrating a light emitting device packageaccording to a first embodiment of the present invention;

FIGS. 2 to 5 are views illustrating various shapes of a light emittingdevice package;

FIG. 6 is a sectional view illustrating a light emitting device packageaccording to a second embodiment of the present invention;

FIG. 7 is a plan view in which light emitting device packages of FIG. 6are linearly arranged; and

FIG. 8 is an enlarged view of an “A” portion of FIG. 7.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, preferred embodiments of the present invention will bedescribed in detail with reference to accompanying drawings.

First Embodiment

FIG. 1 is a sectional view illustrating a light emitting device packageaccording to a first embodiment of the present invention.

Referring to FIG. 1, the inventive light emitting device package 100mainly includes light emitting device chips 101, 102 and 103; a lensunit 130; and a circuit board 120.

In detail, the light emitting device chips 101, 102 and 103 have acombined structure of at least one red light-emitting-device chip 101,at least one green light-emitting-device chip 102 and at least one bluelight-emitting-device chip 103, which respectively express Red (R), Blue(B) and Green (G). FIG. 1 illustrates a line-arranged shape of threeRGB, but the present invention is not limited to the line-arranged shapeand can also arrange the RGB to have various shapes of FIGS. 2 to 5.

Further, the lens unit 130 is comprised of a fresnel lenses 131. Thefresnel lens 131 has a middle convex-shaped portion, and left and rightsymmetric portions, which respectively have a concave-convex shape andhave the almost same height as the middle convex-shaped portion.

Here, the lens unit 130 can have a structure that a plurality of fresnellenses are integrated.

The above-constructed fresnel lens has an advantage in that a height canbe reduced and the same or more excellent luminance and diffusion can bemaintained in comparison with a lens structure caused by a related-artmolding.

Further, the circuit board 120 is formed using a metal PCB (Metal CorePrinted Circuit Board). The light emitting device chips 101, 102 and 103are mounted on and a plurality of electrical wirings are provided at thecircuit board 120. In other words, though not illustrated in detail, aplurality of wires are formed at the circuit board 120, and the lightemitting device chips 101, 102 and 103 are connected to the circuitboard 120 by a flip chip or wire bonding. The metal PCB of the circuitboard 120 has a large area to mount a plurality of chips, andelectrically connects terminals of the mounted chips to apply a current,thereby operating the chips.

Further, since the circuit board 120 is formed of metal, a high heat canbe dissipated from the mounted light emitting device chips 101, 102 and103 to the exterior through the circuit board 120. Therefore, thecircuit board 120 is excellent in heat sink. A heat sink plate 150 canbe separately additionally attached to or can be integrated with thecircuit board 120 in order to increase an effect of heat sink of thecircuit board 120. The heat sink plate 150 is concave-convex shaped andhas a wide surface area for the heat sink.

Furthermore, a barrier part 111 is provided to improve a luminousefficiency of the light emitting device chips 101, 102 and 103 mountedon the circuit board 120. The barrier part 111 functions to support thelens unit 130 and improve a light emission efficiency of the mountedlight device chips 101, 102 and 103. The barrier part 111 is formed ofcopper (Cu), aluminum (Al), and polycarbonate (PC). A reflection coatingfilm can be formed of argentum (Ag) on an inner surface of the barrierpart 111, that is, at a region at which an emission light of the lightemitting device chips 101, 102 and 103 is in direct contact with thebarrier part 111.

Here, the barrier part 111 can has a structure that a plurality ofbarriers are integrated.

After the barrier part 111 is fixed to the circuit board 120, a moldingpart 122 is formed in a space where the light emitting device chips 101,102 and 103 are placed. The molding part 122 is formed by filling asilicon resin having a predetermined refractive index, so as to protectthe light emitting device chips 101, 102 and 103 and the flip chip/wirebonding while maximizing an external quantum efficiency.

As described above, the inventive light emitting device package 100 isprovided as one module structure, by assembling the plurality of lightemitting device chips 101, 102 and 103; the barrier part 111 disposedaround the light emitting device chip; the lens unit 130 comprised ofthe fresnel lens 131 with a variety of shapes; and the circuit board 120for mounting the plurality of light emitting device chips to rapidlydissipate the heat, which is caused by a high-power light, to theexterior.

A method of manufacturing the light emitting device package according tothe present invention is described below.

The plurality of light emitting device chips 101, 102 and 103 aremounted on the circuit board 120. At this time, the wire bonding ratherthan the flip chip bonding is suitable to the red light-emitting-devicechip 101 due to its red light emission. Therefore, the redlight-emitting-device chips 101 are in electric contact with theterminals of the circuit board 120 by the wire bonding.

The green light-emitting-device chips 102 and the bluelight-emitting-device chips 103 are in direct contact with the terminalsof the circuit board 120 by the flip chip bonding.

After the light emitting device chips 101, 102 and 103 are mounted onthe circuit board 120, the barrier part 111 is combined with an upperportion of the circuit board 120 so as to improve a luminous efficiencyof the light emitting device and support the lens unit 130.

The barrier part 111 is structured to have an opened region at which thelight emitting device chips 101, 102 and 103 are placed.

After the barrier part 111 is combined with the upper portion of thecircuit board 120, the resin is injected to form the molding part 122,which functions to mold the light emitting device chips 101, 102 and 103surrounded by the barriers. At this time, since the high-power lightemitting device chips 101, 102 and 103 are mounted, the silicon resin isused as the molding part 122 to prevent degradation and deformation ofthe molding part 122 and prevent a yellowing phenomenon.

After the light emitting device chips 101, 102 and 103 are molded usingthe molding part 122, the lens unit 130 having the fresnel lens 131 iscombined with the barrier part 111. The lens unit 130 is adhered withthe molding part 122 and the barrier part 111 by a constant force.Additionally, when the lens unit 130 is combined with the barrier part111, the lens unit 130 can be strongly combined to the barrier part 111by using a heat-resistant adhesive.

After the lens unit 130 is combined to the barrier part 111, a pin (notshown) can be inserted along an edge of the lens unit 130 to whollyengage the light emitting device package 100 with a product while morestrongly engaging the lens unit 130 to the barrier part 111.

After the lens unit 130 is combined with an upper portion of the barrierpart 111, the concave-convex shaped heat sink plate 150 is attached alower surface of the circuit board 120 of the light emitting devicepackage 100 so as to dissipate out the generated high heat of thehigh-power light emitting device chip. As a result of the above process,the light emitting device package 100 is completed.

As described above, the present invention provides one packagestructure, which is obtained by directly arranging a plurality of thehigh-power light emitting device chips on the circuit board 120 and thencombining the barrier part 111, the lens unit 130 and the heat sinkplate 150 with one another.

Specifically, when the plurality of light emitting device chips areembodied as the high-luminance light emitting device package 100, theheat sink plate 150 is additionally attached to rapidly dissipate thehigh heat, which is caused by a high-power light, outside of the lightemitting device package 100.

Further, the molding part 122 or the light emitting device chips 101,102 and 103 can include at least one kind of phosphor. For example, ayellowish YAG-based or silicate-based phosphor can be added to the bluelight-emitting-device chip to emit a white light.

FIGS. 2 to 5 are views illustrating various shapes of the light emittingdevice package.

Referring to FIG. 2, the lens unit 130 has a low height and isline-shaped. The fresnel lenses 131 are respectively arranged in a line.Of course, the light emitting device chips are respectively disposed atlower sides of the fresnel lenses 131, and are disposed in a line alongthe barrier part 111 and assembled with the circuit board and the heatsink plate in one module format.

The light emitting device package having the fresnel lenses 131 packagedin the line shape can be used as a backlight of a liquid crystal displaydevice.

A circular-shaped light emitting device package of FIG. 3 can be used asan illumination of a signal apparatus, a car front light and an indoorillumination light.

The rectangular or hexagonal-shaped light emitting device package 100 ofFIGS. 4 and 5 can be used as various light parts for a daily life, suchas an illumination light, an ocean signal light, an emergency light, astadium illumination light, and a searchlight.

According to the present invention, the high-power light emitting devicecan be packaged in various patterns, and the light emitting devicepackage can rapidly dissipate the generated high heat of the lightemitting device, to the exterior. Therefore, the light emitting devicepackage can be used as a high-luminance light emitting device packagemodule. In addition, since the plurality of light emitting devices arepackaged, a manufacture process can be simplified and a cost can bereduced.

Second Embodiment

FIG. 6 is a sectional view illustrating a light emitting device packageaccording to a second embodiment of the present invention.

Referring to FIG. 6, the inventive light emitting device package 300includes a light emitting device module 400; a circuit board part 500,and a lens unit 380.

Additionally, the light emitting device module 400 includes a lightemitting device chip 330; first and second barriers 310 and 320; and amolding part 370. The circuit board part 500 includes an electriccircuit layer 340; a circuit layer electrode 360; an insulating layer350; and a metal PCB base 390.

The electric circuit layer 340, the insulating layer 350 and the metalPCB base 390 constitute a metal PCB as a single unit.

The metal PCB base 390 mounts and supports other structural elementssuch as the electric circuit layer 340 and the insulating layer 350 inits upper direction. The metal PCB base 390 rapidly dissipates thegenerated heat of the light emitting device chip 330 in its lowerdirection. For this, the metal PCB base 390 can have a lower layerformed of a high thermal-conductive metal such as aluminum and copper,and can be formed of a compressed semiconductor-based material or becoated with a thermal conductive material to improve a function ofthermal dissipation.

A heat sink plate (referring to a reference numeral 150 of FIG. 1) canbe additionally combined with a lower surface of the metal PCB base 390.The heat sink plate and the metal PCB base can respectively have athrough-hole to allow them to mutually combine with each other in ascrew-type connection way.

The insulating layer 350 electrically insulates the electric circuitlayer 340 from the metal PCB base 390.

The electric circuit layer 340 is disposed on the insulating layer 350.The inventive light emitting device package 300 includes an individuallymodularized light emitting device chip 330. A circuit for arranging thelight emitting device chip 330 is provided at the electric circuit layer340. At this time, a plurality of light emitting devices can be togetherseated in the light emitting device chip 330. For example, three Red,Green and Blue light emitting devices can be seated together.

As described above, in case where the light emitting device chip 330 isprovided as a single module where the plurality of light emittingdevices are seated on one metal PCB base 390, it is advantageous indesign that the electric circuit layer 340 is comprised of aseries-connected circuit. Of course, it can be comprised of aparallel-connected circuit depending on an applied voltage.

The circuit layer electrode 360 for electrically conducting with thelight emitting device chip 330 is disposed at an end of the electriccircuit layer 340. The end is formed by cutting away a portion of theelectric circuit layer 340. The light emitting device chip 330 and thecircuit layer electrode 360 are wire-bonded with each other.

The circuit layer electrode 360 can be formed in an electroplating way.Further, the circuit layer electrode 360 can be electroplated on itsupper surface by using an excellent thermal conductive metal, to improvean electric conductivity. For example, the circuit layer electrode 360is generally formed of metal such as nickel, and can be electroplated onits upper surface with gold or aluminum. It is effective that theelectroplated layer is formed of gold in an electrolytic plating way, tohave a thickness of 0.3 μm or more.

As described above, the light emitting device chip 330 has the lightemitting device using a compound semiconductor and an electrode (notshown) for transmitting the current to the light emitting device.

Aforementioned above, the light emitting device module 400 is disposedon the insulating layer 350 and the electric circuit layer 340, and iselectrically connected with the circuit layer electrode 360.Additionally, when the light emitting device chip 330 is mounted on themetal PCB base 390, it can be firmly seated by an adhesive member suchas a thermal conductive curing agent.

Further, the light emitting device chip 330 can be provided as any oneof a Silicon Optical Bench (SiOB) chip, a red light-emitting-devicechip, a green light-emitting-device chip, a blue light-emitting-devicechip, a yellow light-emitting-device chip, and an orangelight-emitting-device chip. Specifically, the SiOB chip refers to a chiphaving the light emitting device mounted in a cup-shaped space obtainedby etching a silicon substrate.

The barriers 310 and 320 can be multi-folded to have a ring shape, butthey have a two-fold structure in an embodiment of the presentinvention. The molding part 370 is provided within the first barrier 310of the two-fold barrier, and the lens unit 380 is combined to the secondbarrier 320.

Since the barriers 310 and 320 are manufactured in a multi silkscreenway, they can be called as a silkscreen layer. The first barrier 310 canfunction to support the molding part 370, and the second barrier 320 canfunction to support the lens unit 380.

In detail, the first barrier 310 houses the light emitting device chip330 and the molding part 370 for protecting a wire, and functions as adam not to allow an injected molding liquid to flow outside of the firstbarrier 310. When the molding part 370 is combined to the first barrier310, it is convex-shaped to have a lens shape. The molding part 370 canbe formed of a synthetic resin such as epoxy or silicon.

The molding part 370, which is a kind of high-refractive filler,uniformly disperses the emission light of the light emitting device chip330. The molding part 370 is elevated at its middle portion to beconvex-shaped in an upper direction, due to a surface tension caused byan upper end of the first barrier 310.

Additionally, the second barrier 320 functions to combine the lens unit380 outside of the molding part 370. The lens unit 380 can be associatedwith the molding part 370 to minimize an optical loss of the lightradiated.

As described above, when the lens unit 380 is combined to the secondbarrier 320, it can have various shapes such as a concave-shaped lens, aconvex-shaped lens, a trapezoid-shaped lens, an inverted pyramid-shapedlens, and a fresnel lens. The lens unit 380 can be adequately selecteddepending on a desired radiation direction of the light. As shown, incase where the lens unit 380 is the fresnel lens, the second barrier 320can be disposed a little higher than the first barrier 310.

Further, a space between the lens unit 380 and the molding part 370 isprovided in a vacuum environment, to increase the luminance of the lightemitting from the light emitting device chip 330.

Meanwhile, the barriers 310 and 320 are manufactured on the metal PCB byusing the silkscreen process. If the silkscreen process is onceperformed on the metal PCB, a silkscreen is coated at a height of about15 μm. Accordingly, in the embodiment of the present invention, thesilkscreen process is repetitively performed at many times (more thanabout four times) so that the silkscreen has a height of about 50 to 100μm.

Additionally, the light emitting device module 400 can include at leastone kind of phosphor. For example, a yellowish YAG-based orsilicate-based phosphor is provided to allow the bluelight-emitting-device chip to express the white light. Here, thephosphor is provided at the molding part 370 or the light emittingdevice chip 330.

FIG. 7 is a plan view in which the light emitting device packages ofFIG. 6 are linearly arranged, and FIG. 8 is an enlarged view of a “A”portion of FIG. 7.

Referring to FIGS. 7 and 8, the light emitting device package 300 isplaced in plurality on the metal PCB. Additionally, the electric circuitlayer 340 is series-connected with the plurality of light emittingdevice chips 330 on the metal PCB base 390. Of course, the insulatinglayer 350 is interposed between the electric circuit layer 340 and themetal PCB base 390 to cut off an electric leakage of the electriccircuit layer 340.

As such, the inventive plurality of light emitting device packages 300are provided to be of a type in which they are placed on a single metalbase. Therefore, they can be more adequately used as a part ofequipments such as the liquid crystal display device.

Further, in order to allow the light emitting from each of the lightemitting device package 300 to the exterior to be again reflected fromthe metal PCB base 390, it is desirable that the electric circuit layer340 and the insulating layer 350 have a reflection material or aregloss-coated at their exposed portions.

Here, the light emitting device of the light emitting device chip 330can be respectively constructed depending on its kind. For example, thelight emitting device chips can be constructed for each of red (R),green (G) and blue (B).

As described above, the inventive light emitting device package 300modularizes a reflection cup, a mold frame, a lead frame, a lens and thelike of a related-art light emitting device package, on the metal PCBbase. Therefore, the present invention has an advantage in that thepackage is reduced in size and the arrangement is more freely made, andan individual modularization can be made to improve a heat sink effect.

Further, when the inventive light emitting device package is used as alight source of the liquid crystal display device, it can be employed ina direct-under way or an edge way. Generally, in the direct-under wayapplied to a display screen having a size of 20 or more inches, thelight emitting device module is disposed in front at a rear surface of adiffusion plate. Generally, in the edge way applied to a display screenhaving a size of 20 or less inches, the light emitting device module ispositioned at upper and lower ends of the rear surface of the diffusionplate and a light guide plate is fixed at its middle portion.

INDUSTRIAL APPLICABILITY

As described above, the present invention has an advantage in that theplurality of light emitting devices are packaged and mounted to maximizethe luminance, and the heat sink plate is attached to a rear surface ofthe light emitting device package to provide an excellent heat sink.

Further, the present invention has an advantage in that since theplurality of light emitting device are packaged and mounted as onepackage, a manufacture process can be simplified.

Furthermore, the present invention has an effect in that the package isreduced in size and thickness and applied to the liquid crystal displaydevice, which is in a trend of miniaturization, thereby contributing tothe thinning of the liquid crystal display device.

Additionally, the present invention has an effect in that since themanufacture process can be improved such as the use of the silkscreen todirectly mount the individually modularized light-emitting-devicepackage, a material cost can be reduced and a process can be minimized.

While the present invention has been described and illustrated hereinwith reference to the preferred embodiments thereof, it will be apparentto those skilled in the art that various modifications and variationscan be made therein without departing from the spirit and scope of theinvention. Thus, it is intended that the present invention covers themodifications and variations of this invention that come within thescope of the appended claims and their equivalents.

1. A light emitting device package comprising: a circuit board; at leastone barrier part provided to have a predetermined thickness above thecircuit board; at least one light emitting device chip seated at aninternal space of the at least one barrier part, and having a powersource applied from the circuit board; a molding part filling theinternal space of the at least one barrier part where the light emittingdevice chip is housed; and a lens unit having at least one lens providedat an upper side of the molding part.
 2. The package according to claim1, wherein a selected light emitting device chip of the at least onelight emitting device chip has at least one light emitting device. 3.The package according to claim 1, wherein the lens unit has a structurethat a plurality of lenses are integrated.
 4. The package according toclaim 1, wherein the circuit board is a metal circuit board.
 5. Thepackage according to claim 1, wherein the at least one light emittingdevice chip is selected from a SiOB (Silicon Optical Bench) chip, a redlight-emitting-device chip, a blue light-emitting-device chip, and agreen light-emitting-device chip.
 6. The package according to claim 1,wherein the at least one barrier part comprises a plurality ofintegrated barriers provided at the circuit board in various patterns.7. The package according to claim 1, wherein the molding part or the atleast one light emitting device chip has at least one kind of phosphor.8. A light emitting device package comprising: a light emitting devicemodule comprising: a light emitting device chip comprised of at leastone light emitting device, a first barrier for housing the lightemitting device chip, and a molding part provided in an internal spaceof the first barrier; a circuit board comprising: an electric circuitlayer having a circuit electrically connecting with the light emittingdevice module, an insulating layer provided at a lower surface of theelectric circuit layer, and a metal core PCB (Print Circuit Board) basefor dissipating a heat to the exterior; and a lens unit provided at anupper side of the light emitting device module.
 9. The package accordingto claim 8, wherein the lens unit is fixed to a second barrierpositioned outside of the first barrier.
 10. The package according toclaim 8, wherein the lens unit is comprised of any one of aconcave-shaped lens, a convex-shaped lens, a trapezoid-shaped lens, aninverted pyramid-shaped lens and a fresnel lens.
 11. The packageaccording to claim 8, wherein the light emitting device module isseries-connected or parallel-connected in plurality to the circuitboard.
 12. The package according to claim 8, wherein the light emittingdevice module is disposed in plurality at the circuit board to be in arow or in plural rows.
 13. The package according to claim 8, wherein thelight emitting device chip comprises red, green and blue light emittingdevices disposed in parallel.
 14. The package according to claim 8,wherein the electric circuit layer has an electrode electricallyconnecting with the light emitting device chip.
 15. The packageaccording to claim 8, wherein the light emitting device module is usedas a light source of a signal displaying device or a display device. 16.The package according to claim 8, wherein the circuit board has a heatsink plate at its lower portion.
 17. The package according to claim 8,wherein the metal core PCB base has a thermal conductive material coatedon its lower portion.
 18. The package according to claim 8, wherein thelight emitting device module is comprised of at least one of a redlight-emitting-device chip, a green light-emitting-device chip, a bluelight-emitting-device chip, a yellow light-emitting-device chip and anorange light-emitting-device chip.
 19. The package according to claim 8,wherein the light emitting device chip is a SiOB (Silicon Optical Bench)chip.
 20. The package according to claim 8, wherein the circuit layerelectrode is plated with gold or aluminum.
 21. The package according toclaim 8, wherein the light emitting device module has at least one kindof phosphor.
 22. The package according to claim 8, wherein the barrierhas a thickness of 50 to 100 μm.
 23. The package according to claim 8,further comprising a reflection material or a gloss agent at externallyexposed surfaces of the electric circuit layer and the insulating layer.24. A light emitting device package comprising: a plurality of lightemitting devices; a metal circuit board for seating the plurality oflight emitting devices thereat to input and output a power source to andfrom the plurality of light emitting devices; a barrier surrounding eachlight emitting device of the plurality of light emitting devices andabove the metal circuit board; and a lens unit disposed at an upper sideof the barrier.
 25. The package according to claim 24, wherein thebarrier reflects light emitted from the plurality of light emittingdevices.
 26. The package according to claim 24, further comprises a heatsink plate attached to a rear surface of the circuit board to dissipatea heat to the exterior.
 27. The package according to claim 24, whereinthe lens unit has a fresnel lens.
 28. The package according to claim 24,wherein the barrier is two-folded.
 29. The package according to claim24, wherein the barrier is formed of copper (Cu), aluminum (Al) orpolycarbonate.
 30. A method of manufacturing a light emitting devicepackage, the method comprising: mounting a plurality of light emittingdevices above a metal circuit board; providing a barrier above thecircuit board; performing a molding process in an internal space of thebarrier where the light emitting device is mounted; and attaching a lensat an upper side of the barrier after the molding process is performed.31. The method according to claim 30, further comprising providing aheat sink plate at a rear surface of the circuit board.
 32. The methodaccording to claim 30, wherein the barrier is two-folded.